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Wafer scale epitaxial germanium on silicon (0 0 1) using pulsed laser annealing

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Abstract Pulsed Nd:YAG (1064 nm) laser was used to crystallize amorphous germanium thin-films on silicon (001) wafer to get epitaxial Ge. Film thickness and laser fluence played a crucial role.… Click to show full abstract

Abstract Pulsed Nd:YAG (1064 nm) laser was used to crystallize amorphous germanium thin-films on silicon (001) wafer to get epitaxial Ge. Film thickness and laser fluence played a crucial role. Thicker films (≥300 nm) are polycrystalline while thinner films are epitaxial. Rocking curve measurements show improvement in crystallinity with increase in laser fluence. The full 2-inch laser crystallized wafer has omega scan of 0.20° and implied threading dislocation density of 6x108 cm-2. Hence, a fast, cost-effective, and low thermal budget process is used to achieve epitaxial Ge on Si for large area applications.

Keywords: laser; scale epitaxial; germanium; germanium silicon; epitaxial germanium; wafer scale

Journal Title: Materials Letters
Year Published: 2020

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