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Synthesis of highly antioxidant and low-temperature sintering Cu-Ag core-shell submicro-particles for high-power density electronic packaging

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Abstract The highly antioxidant Cu-Ag core-shell submicro-particles (Cu@Ag particles) were synthesized by “two steps” including replacement reaction and chemical reduction deposition. The Cu submicro-particles with fine size and dispersion were… Click to show full abstract

Abstract The highly antioxidant Cu-Ag core-shell submicro-particles (Cu@Ag particles) were synthesized by “two steps” including replacement reaction and chemical reduction deposition. The Cu submicro-particles with fine size and dispersion were purchased as cores. Glycol was used as reaction solvent and acted as the reductant at high temperature. The results indicate that Cu@Ag particles with complete, uniform and dense Ag-shells (about 100 nm thickness) were synthesized successfully during reaction at 90 ℃ for 40 min and 150 ℃ for 20 min subsequently, with formic acid added. What’s more, the nanostructure on surface of the Ag-shell made the low-temperature sintering possible. Finally, Cu-Cu joints with high shear strength of 97.86 MPa were obtained with Cu@Ag particles by pressure sintering (250 ℃ for 15 min under 10 MPa) in atmosphere.

Keywords: highly antioxidant; shell; temperature; submicro particles; core shell

Journal Title: Materials Letters
Year Published: 2021

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