LAUSR.org creates dashboard-style pages of related content for over 1.5 million academic articles. Sign Up to like articles & get recommendations!

Investigation of the thermal deformation of a chip-scale packaged optical accelerometer

Photo by charlesdeluvio from unsplash

Abstract Accelerometers based on optical cavity have a complicated situation of thermal deformation, which significantly influences the measurement results. In order to minimize the thermal drift of the accelerometer, a… Click to show full abstract

Abstract Accelerometers based on optical cavity have a complicated situation of thermal deformation, which significantly influences the measurement results. In order to minimize the thermal drift of the accelerometer, a preliminary multilayer structure package design is proposed. A simplified finite element model of this design is built and further optimized in consideration of boundary conditions to compare the thermal drift of the prototype of the accelerometer. The theoretical calculations of the temperature distribution and structure deformation successfully verify the correctness of the simulation results. The relationships between the material properties and the thermal deformation, as well as the vibration of optical path length are obtained via simulation and theoretical calculation; thus, providing a characteristic formula of the optical path length and the material properties. The relationships can be considered a strong guide for the design of multilayer-structure accelerometers with high temperature stability.

Keywords: thermal deformation; deformation; deformation chip; chip scale; investigation thermal; accelerometer

Journal Title: Measurement
Year Published: 2020

Link to full text (if available)


Share on Social Media:                               Sign Up to like & get
recommendations!

Related content

More Information              News              Social Media              Video              Recommended



                Click one of the above tabs to view related content.