LAUSR

The strategy for fabricating bendable micro-light emitting diode arrays is presented and the mechanical properties of bent arrays are analysed in this paper. The key procedures of the fabrication process consist of grooving the wafer, welding the upside electrode with an indium tin oxide current-spreading layer, integrating the micro-pixels, removing the substrate, electroplating the backside electrode, and encapsulating the device. In order to prevent potential physical destruction and improve the reliability and fatigue of the arrays, the position of the neutral mechanical plane was calculated. Strain and stress distributions in bent LED arrays showed that strain concentrated in the polymers and the generated stress preferentially concentrated in the electrodes and semiconductor. These results indicate that physical destruction, rupture, or delamination may first occur in the electrodes or semiconductor interface. Display Omitted A strategy for fabricating polymer-integrated bendable micro-LED arrays is presented.Potential physical destructions likely occur in the regions around LED pixel edges.Bent the sample with radius of 10mm found no observable degradation.