LAUSR.org creates dashboard-style pages of related content for over 1.5 million academic articles. Sign Up to like articles & get recommendations!

Potential changes and chemical bonding features for Si-MOS structure as evaluated from HAXPES analysis

Photo from wikipedia

An Au/SiO2/Si MOS structure was fabricated by the thermal oxidation of H-terminated Si(100) surface and the electrode formation, and hard X-ray photo-emission spectroscopy (HAXPES) measurements of MOS structure under the… Click to show full abstract

An Au/SiO2/Si MOS structure was fabricated by the thermal oxidation of H-terminated Si(100) surface and the electrode formation, and hard X-ray photo-emission spectroscopy (HAXPES) measurements of MOS structure under the different applied bias conditions were performed systematically to investigate the potential distribution such as the band bending in the MOS structure and the chemical bonding features in the region near the Au/SiO2 interface. And, the measured energy position of HAXPES signals originating from the Au electrode, SiO2, and Si substrate were compared with the calculation results of potential change for ideal MOS structure in consideration of SiO2 thickness and impurity concentration of Si substrate. Display Omitted HAXPES measurements of Au/SiO2/Si structure under the biasing were performed.Potential distribution and bonding features for MOS structure were studied.Measured energy shift of SiO2 and Si was compared with calculated potential change.

Keywords: features mos; bonding features; chemical bonding; mos structure; structure

Journal Title: Microelectronic Engineering
Year Published: 2017

Link to full text (if available)


Share on Social Media:                               Sign Up to like & get
recommendations!

Related content

More Information              News              Social Media              Video              Recommended



                Click one of the above tabs to view related content.