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Abstract A novel temporary bonding and debonding using polypropylene carbonate (PPC)-based bilayer has been proposed and investigated in this paper for the first time. Photo acid generator (PAG) and copper… Click to show full abstract
Abstract A novel temporary bonding and debonding using polypropylene carbonate (PPC)-based bilayer has been proposed and investigated in this paper for the first time. Photo acid generator (PAG) and copper nanopowder are investigated as PPC loadings. For bilayer bonding structure, the highest average shear strength is 3.8 MPa, which is much higher than that of PAG-PPC bonding. During the debonding process, the PPC layer acts as barrier between PAG-induced acid and the substrate, which protects the substrate. This debonding approach has the ability to improve the device reliability, along with the advantages of room temperature debonding without any solvent based treatment. Experiments have been conducted and validated the proposed temporary bonding and debonding scheme.
Journal Title: Microelectronic Engineering
Year Published: 2017
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