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Abstract A novel space vector modulation (SVM) strategy called maximum-boost discontinuous SVM (MBDSV) is proposed in this paper to reduce the thermal stress of three phase impedance source inverters (ISI).… Click to show full abstract
Abstract A novel space vector modulation (SVM) strategy called maximum-boost discontinuous SVM (MBDSV) is proposed in this paper to reduce the thermal stress of three phase impedance source inverters (ISI). By exploiting the switch clamping mechanism and arranging the shoot-through (ST) states properly, the proposed strategy obtains the flowing merits: further optimize the thermal performance, improve the reliability, reduce the current stress and maximize the dc-link utilization of ISI. The proposed MBDSV was compared to the existing modulation strategies and the feasibility of the MBDSV had been benchmarked by simulation and experiments.
Journal Title: Microelectronics Reliability
Year Published: 2020
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