LAUSR

Abstract Properly assessing the underlying physics of failure is critical in predicting the long term reliability of electronic packages in their intended field applications, yet traditional reliability demonstration methods are complicated by time and cost considerations as well as deterministic inadequacies when considering thermomechanical failures. In this work, an alternative reliability testing apparatus and associated protocol were utilized to provide clarity and insight to solder fatigue mechanisms at the device scale; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. A test stand was developed to allow for bi-directional application of shear stress at elevated steady-state temperatures. Utilizing the mechanical force of springs to apply shear loads to solder interconnects within the devices, the reliability of a given device to withstand repeated cycling was studied using in situ resistance monitoring techniques to detect the number of cycles-to-failure (CTF) based on a 30% resistance increase criterion. A mathematical method for quantifying the plastic work density (amount of damage) sustained by the solder interconnects prior to failure was developed relying on the relationship between Hooke's Law for springs and damage deflection to accurately assess the mechanical strength of tested devices.