Photo from archive.org
Abstract We develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and… Click to show full abstract
Abstract We develop wire saws with the diamond grains bonded to the wires for non-slurry cutting process. We invented a special product machine which has a high vacuum furnace and a special solder that contain a metallic compound. In this paper we demonstrate the finest saw wire that is 50 µm of diameter tungsten (W) wires and can perform in cutting an extremely hard material which include the diamond substrate.
Keywords:
development fixed;
saw wire;
fixed grain;
wire;
micro saw;
grain micro
Journal Title: Procedia Manufacturing
Year Published: 2017
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!
Journal Title: Procedia Manufacturing
Year Published: 2017
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!