Photo from wikipedia
Abstract The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was… Click to show full abstract
Abstract The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins.
Keywords:
grain orientation;
orientation;
effect grain;
formation;
intermetallic compounds
Journal Title: Scripta Materialia
Year Published: 2017
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!
Journal Title: Scripta Materialia
Year Published: 2017
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!