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Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains

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Abstract The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform… Click to show full abstract

Abstract The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy.

Keywords: grain boundary; length scale; boundary strengthening; strengthening length; additional grain; grain

Journal Title: Scripta Materialia
Year Published: 2019

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