Abstract During wire sawing of silicon ingot into wafers, 40% of silicon is lost and being combined to cutting fluid to form the kerf slurry waste. Recycling this slurry containing… Click to show full abstract
Abstract During wire sawing of silicon ingot into wafers, 40% of silicon is lost and being combined to cutting fluid to form the kerf slurry waste. Recycling this slurry containing silica materials represents an economical method to manage this waste. A study on recycling SiC and its use for the preparation of sodium silicates (Na2SiO3) precursor to synthesize silica gel was conducted. The recycling process included a liquid-liquid extraction and alkali dissolution that were optimized to generate a mixture of powder containing 28% Si and 72% SiC. The alkali dissolution process was carried out by sodium hydroxide in optimal conditions of the mass ratio (NaOH/Slurry), temperature, and reaction duration. NaOH reacted with silicon in the slurry waste to prepare the Na2SiO3 precursor for the synthesis of silica xerogel by employing a Sol-Gel method. X-ray diffraction (XRD), Scanning Electron Microscopy coupled with Energy Dispersive Spectrometric Analysis (SEM-EDS), and optical microscopy were used to characterize the structure, composition, and morphology of the powder. In our study, a SiC with 99.4% purity was obtained and the gels formed are irreversible and present a syneresis which leads to a consolidated solid.
               
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