Abstract Thin crystalline silicon (c-Si) photovoltaic (PV) cells ( 200 °C) soldering causes frequent wafer breakage in thin c-Si-based modules. Hence, in this work, we proposed low-temperature interconnection method using conductive… Click to show full abstract
Abstract Thin crystalline silicon (c-Si) photovoltaic (PV) cells ( 200 °C) soldering causes frequent wafer breakage in thin c-Si-based modules. Hence, in this work, we proposed low-temperature interconnection method using conductive paste (CP) for thin c-Si PV modules and systematically studied the modules’ electrical and mechanical properties as a function of annealing temperature of CP. The potential advantage of this method is significantly reduced wafer bowing due to the low-temperature tabbing (
               
Click one of the above tabs to view related content.