LAUSR

Abstract SiC MOSFET with three-section edge termination is investigated in this paper. The edge termination for SiC MOSFET is divided into three sections with different field limited rings and the space between rings, which benefits to achieve uniform electric field and high breakdown voltage (BV). The degradation mechanism of BV and on-resistance during high temperature reverse bias (HTRB) and high temperature gate bias (HTGB) experiment are revealed. For HTRB, positive oxide trapped charge generation on SiC/SiO2 surface enhances the electric field peak at breakdown point, which is responsible for BV decreasing. For HTGB, negative oxide trapped charge generation on SiC/SiO2 surface is responsible for the increase of threshold voltage and on-resistance.