LAUSR

&NA; Un‐deformed chip thickness is a critical parameter in machining processes. Measuring un‐deformed chip thickness experimentally is a complicated process, especially in micro machining and may not even be measured accurately. The un‐deformed chip thickness has an influence on material removal rate, cutting forces, specific energy and surface finish etc. In ceramic machining, it is also an indication of material removal mode such as ductile or brittle fracture. In the present study, an effort is made to model undeformed chip thickness, cutting forces and specific cutting energy in rotary ultrasonic machining (RUM) applied to the side milling operation. RUM may be considered as super‐imposition of ultrasonic vibrations on the grinding process. The kinematics of ultrasonic motion has been applied to the grinding for the development of the RUM process models. To validate the models, machining experiments have been performed on borosilicate glass in RUM and grinding modes. Percentage of ductile mode of fracture for the machined surfaces has been evaluated using SEM images. Surface roughness values have also been compared for the same material removal rate conditions to ascertain fracture mode. Developed models have been verified and found that ductile mode of fracture as well as surface finish were higher in RUM as compared to grinding process for same material removal rate. RUM process for six aerospace grade materials has also been tried using micro and macro tools and size effects studied.