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A novel agglomerated diamond abrasive with excellent micro-cutting and self-sharpening capabilities in fixed abrasive lapping processes

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Abstract The processing efficiency and stability of ultra-hard and brittle materials plannarized by fixed abrasive pads (FAPs) are largely determined by the cutting depth and the available number of active… Click to show full abstract

Abstract The processing efficiency and stability of ultra-hard and brittle materials plannarized by fixed abrasive pads (FAPs) are largely determined by the cutting depth and the available number of active cutting abrasives and the abrasive wear behaviors. A newly prepared agglomerated diamond (AD) abrasive embedded in FAPs has demonstrated a significant improvement on processing efficiency and stability while being used to lap hard-to-processed ceramic materials. A mathematical model was built to explain the high removal efficiency of the AD abrasives, which followed a similar trend with experimental testing results. The micro-cutting and self-sharpening capabilities of the AD abrasive, which afforded FAPs with AD abrasives to improve efficiency and stability, were manifested by our experimental examinations on the worn abrasive morphologies, the fall-out diamond chips and scratch marks left on sapphire substrates by AD abrasives.

Keywords: cutting self; diamond; fixed abrasive; micro cutting; agglomerated diamond; diamond abrasive

Journal Title: Wear
Year Published: 2021

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