LAUSR

In order to advance flexible electronic technologies it is important to study the combined electromechanical properties of thin metal films on polymers substrates under mechanical load. Ductile films and lines are an integral part of flexible electronics because they allow current flow between semiconducting islands and other operating features. When ductile films on polymer substrates are strained in tension the substrate can suppress the catastrophic failure that allows for their use in flexible electronics and sensors. However, the charge carrying ductile films must be of an optimum thickness and microstructure for the suppression of cracking to occur [1,2]. In order to improve mechanical and electrical properties of these complex material systems, more work at characterizing the processingstructure-property relationships should be performed. Studies of strained films on polymer substrates tend to emphasize only the electrical properties and thickness effects more than the role of film microstructure or deformation behavior. The microstructure of the film not only determines the mechanical behavior but also influences the electrical behavior and could be optimized if studied in connection with the mechanical behavior.