LAUSR

We report on a novel plasma-assisted approach for the deposition of free-standing two-dimensional superstructures via directed assembly of copper-sulfide nanoplatelets in the gas phase. For this, the copper-organic complex bis-[bis(N,N-diethyldithiocarbamato)-copper(II)] is thermally evaporated and transported into a capacitively coupled rf plasma to form two-dimensional nanoplatelets upon fragmentation. On a substrate, the highly anisotropic platelets are attached in a directed edge-to-edge configuration. We found that a high substrate temperature of 400 °C is necessary for the 2D vertical growth of copper sulfide. Using plasma reinforces the directional assembly and leads to nanowalls which are several micrometers high with the thickness of a single nanoplatelet. The morphology and crystallographic composition of the emerging superstructures were extensively investigated via scanning and transmission electron microscopy as well as electron diffraction. The data reveal the (010) plane to be the preferred axis for the arrangement of the nanoplatelets.