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Thermoelectric Properties of Sub-stoichiometric Electron Beam Patterned Bismuth Sulfide.

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Direct patterning of thermoelectric metal chalcogenides can be challenging and is normally constrained to certain geometries and sizes. Here we report the synthesis, characterization, and direct writing of sub-10 nm… Click to show full abstract

Direct patterning of thermoelectric metal chalcogenides can be challenging and is normally constrained to certain geometries and sizes. Here we report the synthesis, characterization, and direct writing of sub-10 nm wide bismuth sulfide (Bi2S3) using a single source, spin coatable, and electron beam sensitive bismuth(III) ethylxanthate precursor. In order to increase the intrinsically low carrier concentration of pristine Bi2S3, we developed a self-doping methodology in which sulfur vacancies are manipulated by tuning the temperature during vacuum annealing, to produce an electron-rich thermoelectric material. We report a room temperature electrical conductivity of 6 S m-1 and a Seebeck coefficient of -21.41 µV K 1 for a directly patterned, sub-stoichiometric Bi2S3 thin film. We expect that our demonstration of directly-writable thermoelectric films, with further optimization of structure and morphology can be useful for on-chip applications.

Keywords: thermoelectric properties; bismuth sulfide; sub stoichiometric; electron; electron beam

Journal Title: ACS applied materials & interfaces
Year Published: 2020

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