Interfacial compatibility between metal-organic framework (MOF) films and the underneath substrates determines the integrity of MOF films and their associated functions, thus has been gaining growing attention. Herein, we present… Click to show full abstract
Interfacial compatibility between metal-organic framework (MOF) films and the underneath substrates determines the integrity of MOF films and their associated functions, thus has been gaining growing attention. Herein, we present the comparison in adhesion properties from the chip level of two disparate nickel (Ni)-MOF films respectively obtained by direct hydro/solvothermal growth and template-directed conversion approach. We demonstrate that the on-chip delamination/corrugation of the films obtained by the direct growth approach can be circumvented by adopting the template-directed approach, which enables delicate dissolution of primarily grown nanoflaked nickel hydroxide (Ni(OH)2) films and thus triggers the controllable formation of Ni-MOF films. Successful on-chip conversions of Ni(OH)2 layers to different Ni-MOF thin films with good homogeneity, compactness, and appreciable affinity to the substrates are verified by multiple microscopic and spectroscopic techniques. Notably, the resultant Ni-MOF films even show no delamination after activation with addition treatments, such as solvent soaking, nitrogen (N2) blowing for 1 hour, and scotch tape test. As a function demonstration, the Ni-NDC MOF (NDC stands for 2,6-naphthalenedicarboxylate) coated sensor exhibits selective detection toward benzene vapor. This study highlights the importance of interfaces between MOF films and substrates, and provides new perspectives for integrating MOF films onto microelectronic devices with robust adhesion for practical applications.
               
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