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Interfacial Electrochemical Polymerization for Spinning Liquid Metals into Core-Shell Wires.

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Metal wires are of great significance in applications such as three-dimensional (3D) printing, soft electronics, optics, and metamaterials. Ga-based liquid metals (e.g., EGaIn), though uniquely combining metallic conductivity, fluidity, and… Click to show full abstract

Metal wires are of great significance in applications such as three-dimensional (3D) printing, soft electronics, optics, and metamaterials. Ga-based liquid metals (e.g., EGaIn), though uniquely combining metallic conductivity, fluidity, and biocompatibility, remain challenging to be spun due to their low viscosity, high surface tension, and Rayleigh-Plateau instability. In this work, we showed that EGaIn as a working electrode could induce the oxidization of EGaIn and interfacial electrochemical polymerization of electroactive monomers (e.g., acrylic acid, dopamine, and pyrrole), thus spinning itself from an opening of a blunt needle. During the spinning process, the high surface tension of EGaIn was reduced by electrowetting and electrocapillarity and stabilized by polymer shells (tunable thickness of ∼0.6-30 μm on wires with a diameter of 90-300 μm), which were chelated with metal ions. The polymeric shells offered EGaIn wires with an enhanced endurance to mechanical force and acidity. By further encapsulating into elastomers through a facile impregnation process, the resultant elastic EGaIn wires showed a combination of high stretchability (up to 800%) and metallic conductivity (1.5 × 106 S m-1). When serving as wearable sensors, they were capable of sensing facial expressions, body movements, voice recognition, and spatial pressure distributions with high sensitivity, good repeatability, and satisfactory durability. Machine-learning algorithms further assisted to detect gestures with high accuracy.

Keywords: electrochemical polymerization; polymerization spinning; spinning liquid; interfacial electrochemical; liquid metals

Journal Title: ACS applied materials & interfaces
Year Published: 2022

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