LAUSR

Memristors implemented as resistive random-access memories (RRAMs) owing to their low power consumption, scalability, and speed are promising candidates for in-memory computing and neuromorphic applications. Moreover, a vertical 3D implementation of RRAMs enables high-density crossbar arrays at a minimal footprint. Co-integrated III–V vertical gate-all-around MOSFET selectors in a one-transistor-one-resistor (1T1R) configuration have recently been demonstrated where an interlayer (IL)-oxide has been shown to enable high RRAM endurance needed for applications like machine learning. In this work, we evaluate the role of the IL-oxide directly on InAs vertical nanowires using low-frequency noise characterization. We show that the low-frequency noise or the 1/f-noise in InAs vertical RRAMs can be reduced by more than 3 orders of magnitude by engineering the InAs/high-k interface. We also report that the noise properties of the vertical 1T1R do not degrade significantly after RRAM integration making them attractive to be used in emerging electronic circuits.