With the progressive requirements of modern electronics, outstanding electromagnetic interference (EMI) shielding materials are extensively desirable to protect intelligent electronic equipment against EMI radiation under various conditions, while integrating functional… Click to show full abstract
With the progressive requirements of modern electronics, outstanding electromagnetic interference (EMI) shielding materials are extensively desirable to protect intelligent electronic equipment against EMI radiation under various conditions, while integrating functional applications. So far, it remains a great challenge to effectively construct thin films with diversiform frameworks as integrated shielding devices. To simultaneously promote electromagnetic waves (EMWs) attenuation and construct integrated multifunction, an alternating-layered deposition strategy is designed to fabricate polydimethylsiloxane packaged N-doped MXene (Ti3CNTx)/graphene oxide wrapped hollow carbon fiber/silver nanowire films (p-LMHA) followed by annealing and encapsulation approaches. Contributed by the synergistic effect of consecutively conductive networks and porous architectures, LMHA films exhibit satisfying EMI shielding effectiveness of 73.2 dB at a thickness of 11 μm, with a specific EMI shielding effectiveness of 31 150.1 dB·cm2·g-1. Benefiting from the encapsulation, p-LMHA films further impart hydrophobicity and reliability against harsh environments. Besides, p-LMHA devices integrate a rapid-response behavior of the electro/photothermal and, meanwhile, function as a healthcare monitoring sensor. Therefore, it is believed that the p-LMHA films assembled by independent conductive networks with reliability offer a facile solution for practical multimodular protection of devices with integration characteristics.
               
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