Three-dimensional (3D) elastic aerogels enable diverse applications but are usually restricted by their low thermal and electrical transfer efficiency. Here, we demonstrate a strategy for fabricating the highly thermally and… Click to show full abstract
Three-dimensional (3D) elastic aerogels enable diverse applications but are usually restricted by their low thermal and electrical transfer efficiency. Here, we demonstrate a strategy for fabricating the highly thermally and electrically conductive aerogels using hybrid carbon/ceramic structural units made of hexagonal boron nitride nanoribbons (BNNRs) with in situ-grown orthogonally structured graphene (OSG). High-aspect-ratio BNNRs are first interconnected into a 3D elastic and thermally conductive skeleton, in which the horizontal graphene layers of OSG provide additional hyperchannels for electron and phonon conduction, and the vertical graphene sheets of OSG greatly improve surface roughness and charge polarization ability of the entire skeleton. The resulting OSG/BNNR hybrid aerogel exhibits very high thermal and electrical conductivity (up to 7.84 W m-1 K-1 and 340 S m-1, respectively) at a low density of 45.8 mg cm-3, which should prove to be vastly advantageous as compared to the reported carbonic and/or ceramic aerogels. Moreover, the hybrid aerogel possesses integrated properties of wide temperature-invariant superelasticity (from -196 to 600 °C), low-voltage-driven Joule heating (up to 42-134 °C at 1-4 V), strong hydrophobicity (contact angel of up to 156.1°), and powerful broadband electromagnetic interference (EMI) shielding effectiveness (reaching 70.9 dB at 2 mm thickness), all of which can maintain very well under repeated mechanical deformations and long-term immersion in strong acid or alkali solution. Using these extraordinary comprehensive properties, we prove the great potential of OSG/BNNR hybrid aerogel in wearable electronics for regulating body temperature, proofing water and pollution, removing ice, and protecting human health against EMI.
               
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