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Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor

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The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To… Click to show full abstract

The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To understand this phenomenon, the mass change of a sample of alloys was investigated between 40 and 260 °C and the evolved gas was analyzed. In the quest to identify the unwanted deposits, a new strategy was researched and developed to increase the quantity of the produced deposit and to obtain it on a target surface for further studies. Unexpectedly, crystals were produced. The growth process of the crystals was optimized to reach crystal structures at nearly 1 mm in height. Unusual shapes were detected.

Keywords: acid vapor; tin based; formation tin; formic acid

Journal Title: New Journal of Chemistry
Year Published: 2018

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