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The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon… Click to show full abstract
The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible solution to this issue by developing 3D LPF architecture. A 3D LPF based on coaxial TSV is exploited by fabrication and measurement. The measurement result shows good agreement with that obtained by finite element method.
Keywords:
fabrication measurement;
lpf based;
measurement;
based coaxial;
tsv;
coaxial tsv
Journal Title: Electronics Letters
Year Published: 2019
Link to full text (if available)
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Journal Title: Electronics Letters
Year Published: 2019
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!