This letter reports the implementation of double-drift-layer (DDL) design into GaN vertical Schottky barrier diodes (SBDs) grown on free-standing GaN substrates. This design balances the trade-off between desirable forward turn-on… Click to show full abstract
This letter reports the implementation of double-drift-layer (DDL) design into GaN vertical Schottky barrier diodes (SBDs) grown on free-standing GaN substrates. This design balances the trade-off between desirable forward turn-on characteristics and high reverse breakdown capability, providing optimal overall device performances for power switching applications. With a well-controlled metalorganic chemical vapor deposition process, the doping concentration of the top drift layer was reduced, which served to suppress the peak electric field at the metal/GaN interface and increase the breakdown voltages of the SBDs. The bottom drift layer was moderately doped to achieve low on-resistance to reduce power losses. At forward bias, the devices exhibited a record low turn-on voltage of 0.59 V, an ultra-low on-resistance of 1.65 mΩ cm2, a near unity ideality factor of 1.04, a high on/off ratio of ∼1010, and a high electron mobility of 1045.2 cm2/(V s). Detailed comparisons with conventional single-drift-layer (S...
               
Click one of the above tabs to view related content.