LAUSR

It is generally believed that the resistance degradation behavior of bulk and thin-film oxide capacitors arises from the oxygen vacancy migration within the oxide and/or the charge injection at the oxide/electrode interface. The magnitude of the degradation in the resistance has been theoretically studied in the literature by solving the electrochemical transport equations while assuming constant Schottky barrier height. The treatment of constant Schottky barrier height in existing models has led to significant underestimation of the resistance degradation. In this work, I incorporated the dependence of Schottky barrier height on the oxygen vacancy concentration at the interface into the existing model to simulate the degradation process in thin-film oxide capacitors. With the consideration of Schottky barrier height lowering from the interface dipole arising from the accumulation of oxygen vacancies at the cathode interface, I found that the leakage current can be increased by more than one order of magnitude, which is more consistent with experimental observations in comparison to the prediction from existing models.