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The present study numerically simulates a new circular micro heat sink (HS) used to cool electronic equipment (i.e., CPU). The HS contained Al2O3-water nanofluid (NF) at the concentration of 0–1%.… Click to show full abstract
The present study numerically simulates a new circular micro heat sink (HS) used to cool electronic equipment (i.e., CPU). The HS contained Al2O3-water nanofluid (NF) at the concentration of 0–1%. ...
Keywords:
micro heat;
new circular;
electronic equipment;
cool electronic;
heat sink;
used cool
Journal Title: Chemical Engineering Communications
Year Published: 2021
Link to full text (if available)
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Journal Title: Chemical Engineering Communications
Year Published: 2021
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!