Abstract Hot-spots are a common occurrence in power electronics which become increasingly hotter as chips become denser. Novel cooling technologies are emerging to cope with this increasing heat load, which… Click to show full abstract
Abstract Hot-spots are a common occurrence in power electronics which become increasingly hotter as chips become denser. Novel cooling technologies are emerging to cope with this increasing heat load, which imbed a condenser to supply cooling drops to the evaporator resting on the hot-spots. Nonetheless, the evaporation process of the drops has been overlooked. Here, we conducted a series of experiments to understand how the evaporation and motion of drops are influenced by the wetting mode of rough hot-spots. We fabricated three different surfaces exhibiting full (Wenzel) or partial (Cassie–Baxter) wetting and the hot-spot is imposed by laser irradiation. We report a direct link between drop motion and wetting mode with the partial wetting drops being highly mobile, attributable to lower pinning energy based on an energy analysis. This study provides a framework for future modifications in hot-spot cooling to account for drop motion which should greatly influence the overall heat removal performance.
               
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