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As silicon wafers become thinner and easier to warp, it is important to improve production efficiency of dies. In the wafer grinding and dicing process, photo-crosslinkable pressure sensitive adhes... Click to show full abstract
As silicon wafers become thinner and easier to warp, it is important to improve production efficiency of dies. In the wafer grinding and dicing process, photo-crosslinkable pressure sensitive adhes...
Keywords:
photo crosslinkable;
crosslinkable acrylic;
acrylic copolymer;
silicon;
preparation photo
Journal Title: Journal of Adhesion Science and Technology
Year Published: 2021
Link to full text (if available)
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Journal Title: Journal of Adhesion Science and Technology
Year Published: 2021
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!