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ABSTRACT Two copper substrates electroplated with Sn, both consisted of Cu/Sn + Sn/Cu structures, but they were bonded over different times in order to investigate the interfacial reaction. The growth morphologies of… Click to show full abstract
ABSTRACT Two copper substrates electroplated with Sn, both consisted of Cu/Sn + Sn/Cu structures, but they were bonded over different times in order to investigate the interfacial reaction. The growth morphologies of Cu6Sn5 and Cu3Sn were analysed, respectively. The growth mechanisms for Cu6Sn5 and Cu3Sn were investigated. The results show that the growth of Cu6Sn5 is primarily controlled by grain boundary-diffusion. However, the growth Cu3Sn is controlled by the reaction of Cu-Cu6Sn5 at the beginning of the reaction, and then controlled by volume-diffusion as the thickness of the Cu3Sn layer increases.
Journal Title: Materials Science and Technology
Year Published: 2017
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