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This paper describes the challenges in the design of board-level Ku-band power amplifier (PA) using the hybrid-MIC technology. The selection of laminates, connectors, cables and RF components, such... Click to show full abstract
This paper describes the challenges in the design of board-level Ku-band power amplifier (PA) using the hybrid-MIC technology. The selection of laminates, connectors, cables and RF components, such...
Keywords:
power amplifier;
band power;
board level;
level band
Journal Title: Iete Journal of Research
Year Published: 2020
Link to full text (if available)
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Journal Title: Iete Journal of Research
Year Published: 2020
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!