LAUSR

ABSTRACT Micro-scale hole drilling on metallic sheets has been employed in a wide range of personal computing devices, such as smart phones and tablet computers. Laser machining, micro-electro-discharge machining, and chemical etching are the methods used for fabricating micro-scale holes. In this paper, we propose a hybrid sequential stamping and laser machining process. The alignment in the hybrid process is critical, and a patented device called the ball-cone-hole magnet was used in the experiments to achieve an alignment error of less than 1 µm. The fabrication results obtained by laser-only, stamping-only, and the proposed hybrid process were compared. The diameters of inlets and outlets, as well as the cross-section of holes, were compared herein. The surface roughness of the sidewalls’ inside holes was measured. The proposed hybrid stamping and laser machining process provides an alternative fabrication method for the micro-scale hole drilling process with better hole quality than a laser-only machining process.