LAUSR

ABSTRACT Surface wrinkling of thin films on substrates offers an effective strategy to create controllable surface patterns of wide application. In this article, both theoretical analysis and numerical simulations are performed to study the surface wrinkling of thin films bonded on a microstructured soft substrate under compression. We consider two typical kinds of substrates that have different mechanical properties. One possesses a periodic array of micropillars, and the other has a period of alternating unbonded—bonded regions at the film—substrate interface. The characteristics of surface wrinkling and postbuckling evolution of films are revealed. It is found that the interfacial microstructures modulate the normal mechanical properties of the substrate and, thus, tailor the buckling behavior of the thin film atop it. Under lateral compression, the film on the substrate shows periodic arrays of micropillars exhibiting sinusoidal wrinkling first, and then with further compression, the wrinkles give way to a deep fold accompanied by Euler buckling of the micropillars and the decay of neighboring wrinkles. For the system with periodic unbonded—bonded regions at the film—substrate interface, wrinkling of the film is characterized by a relative shift in the normal direction. This study offers potential applications in the fabrication of tunable surface morphologies.