LAUSR

ABSTRACT The melting properties of two kinds of glass substrates for thin film transistor liquid crystal display (TFT-LCD) and organic light-emitting diode (OLED) were investigated. Chemical reaction process of the batches was similar for two substrates determined by DSC-TG test. The ascending behavior of bubbles with different fining agents of two substrates were studied by High-temperature imaging observation (HTO) test. Viscosity and surface tension for the glass melt were investigated. The results showed that tin dioxide (SnO2) exhibited better fining effect than stannous oxide (SnO), both for TFT-LCD and OLED substrates. For OLED substrate, it took more time to approximate the steady state for fining process due to its higher viscosity and higher surface tension. The molten resistance of these two substrates was also determined, which could provide some reference for the design of electrode in mass production. And the effect of grain size distribution of main raw material silica sand on the melting quality of bulk glass samples was also developed. Silica sand with 150–200 mesh exhibited the best melting and fining effect.