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This work suggests a simple method to flatten thick layers (similar to 50-200 mu m) of SU-8 photoresist on small substrates (similar to 1 cm). The method sidesteps the edge… Click to show full abstract
This work suggests a simple method to flatten thick layers (similar to 50-200 mu m) of SU-8 photoresist on small substrates (similar to 1 cm). The method sidesteps the edge beads problem and enables photolithography patterns up to the substrates' edges. Moreover, the method can be used even for substrates with large aspect ratios when the spin coating is largely impossible.
Keywords:
small substrates;
photoresist flat;
making thick;
photoresist;
flat small;
thick photoresist
Journal Title: Journal of Micromechanics and Microengineering
Year Published: 2018
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Journal Title: Journal of Micromechanics and Microengineering
Year Published: 2018
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!