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We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with… Click to show full abstract
We report on the formation of gas bubbles during the release of MEMS devices using buffered oxide etch. Several approaches to mitigate the problem are proposed and tested together with a qualitative study of the phenomenon. The chemical reaction behind such phenomenon and the influence of defects and topography is discussed. Finally, a comparison with the HF-vapor release technique is shown.
Keywords:
release mems;
etching avoid;
vapor etching;
gas bubbles
Journal Title: Journal of Micromechanics and Microengineering
Year Published: 2023
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Journal Title: Journal of Micromechanics and Microengineering
Year Published: 2023
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!