LAUSR

This paper discusses on a low-cost technology for the fabrication of microfluidic devices on glass substrate using metal embossing technique. The fabrication technique demonstrated is a much simpler approach of embossing on glass using thermo-compression process with patterned metal layer to define device structure. Well established Printed Circuit Board (PCB) fabrication photo-process is used to realize desired planar geometry on metal layer deposited over a glass substrate. The depth of the channel is defined by the thickness of the metal which is deposited by electro-plating. The embossing technology offers a relatively safer approach conducive to batch processing to enable repeatable, high-yield low-cost devices fabricated using low-cost equipment. Major challenges of achieving adhesion of deposited thick Nickel layer without peel-off and control of the thermo compression process to achieve reliable and repeatable embossing without structural distortions were addressed. To prove its suitability for manufacturing, experiments were carried out with full wafer of 6” x 6” square glass wafer and optimal process steps for low-cost Micro-fluidic device manufacturing have been well established.