To avoid surface damage of MoS2 channel, mica flake with high permittivity and atomically flat surface was dry transferred onto a multilayer MoS2 flake to prepare top-gated transistors. For the… Click to show full abstract
To avoid surface damage of MoS2 channel, mica flake with high permittivity and atomically flat surface was dry transferred onto a multilayer MoS2 flake to prepare top-gated transistors. For the first time, the interface properties of mica/MoS2 and the long-term stability of devices were investigated when the transistors were exposed to ambient air. Results showed that the electrical performance of the transistors is degraded significantly when the devices are exposed to ambient moisture for a long time due to the strong hydrophilism of mica. That is, the transfer curves of the transistors cannot be recovered to their initial states even after annealing. The adsorbed moisture can become trapped at the interface between the MoS2 channel and mica dielectric or on the MoS2 surface, resulting in enhanced carrier scattering and degraded device performance. However, the top-gated MoS2 transistor with Al2O3 encapsulation exhibits enhanced stability even after either annealing or exposure to atmosphere for 200 days. The excellent stability should be attributed to the effective insulation of moisture from the ambient air by Al2O3 encapsulation. Therefore, a dense and hydrophobic encapsulation layer is indispensable for stable and high-performance top-gated MoS2 transistors with mica gate dielectric.
               
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