LAUSR

With the rapid development of semiconductor chip circuit integration and miniaturization, especially the high integration of microwave chips, it has become critical to realize the surface microwave field imaging for such chips. In this paper, a new method of microwave field imaging for chip surface is proposed based on scanning probe microscopy. We analyse the echo signal and extract the peak-to-peak values to characterize the microwave field intensity on the chip surface by building a theoretical model of the microwave signal coupling. Using a high-precision scanning stage based on a piezoelectric ceramic tube, we realize the imaging of microwave field. The experimental results show that the imaging method can complete the chip surface microwave field imaging, which is important to support the optimization of semiconductor chip manufacturing process, fault analysis and new material research, and promote the development and progress of the semiconductor industry.