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Controlled fracture presents opportunities for the advanced fabrication of thin films. However, programmability analogous to that of Chinese paper cutting is still challenging, where fracture patterns can be created as… Click to show full abstract
Controlled fracture presents opportunities for the advanced fabrication of thin films. However, programmability analogous to that of Chinese paper cutting is still challenging, where fracture patterns can be created as required without preformed cracks for guidance. Here, we establish a design framework for tearing adhesive thin films from foldable substrates with such programmability. Our analytical model captures the observed crack behavior, demonstrating that the deflection of crack paths can exceed 90^{∘}. Besides, for thick foldable substrates with multiple ridges, we additionally propose a robust method of directional fracture where the cracks are forced to extend along the ridges.
Journal Title: Physical review. E
Year Published: 2022
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