LAUSR

Purpose The purpose of this paper was to study the influence of properties of printed circuit boards (PCBs) on the temperature during micro drilling and obtain the influential mechanism of PCBs based on temperature measurement. Design/methodology/approach Experiments were carried out to study the influence mechanism of PCB properties on micro hole drilling temperature under high spindle speed. The temperature measurement platform was applied, then the influence of components ratio of PCBs on the temperature of micro-drilling was analyzed by using comparative analysis method. The mass ratio of each kind of material in the PCB was defined as four levels and the influence mechanism of properties of PCBs based on temperature measurement was summarized. Findings Average filler and lower resin would have a positive impact on micro hole drilling temperature, and the smaller filler size and the even distribution would make it better. Originality/value An infrared temperature measurement platform was applied and influential mechanism of PCB properties on temperature was analyzed, which could provide the reference value on the optimization of temperature during micro drilling.