In this paper, we report a method of increasing the sensitivity of a silicon near-infrared sensor. The sensor is realized by forming multiple trench-type photodiodes in a silicon chip. The… Click to show full abstract
In this paper, we report a method of increasing the sensitivity of a silicon near-infrared sensor. The sensor is realized by forming multiple trench-type photodiodes in a silicon chip. The trench photodiodes can be formed using conventional semiconductor fabrication equipment. The device structure allows the depletion layer to be spread over the entire sensor chip even at a bias voltage of 10 V or less. The sensor chip can thereby extend the collection area of photoelectrons to the maximum. At a chip thickness of 540
               
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