This study reports AlGaN/GaN high-electron-mobility transistors (HEMTs) fabricated by the Stepper Lithography on a 4-inch wafer for Ka-Band applications. Small gate length (LG) of 100 nm was achieved through a… Click to show full abstract
This study reports AlGaN/GaN high-electron-mobility transistors (HEMTs) fabricated by the Stepper Lithography on a 4-inch wafer for Ka-Band applications. Small gate length (LG) of 100 nm was achieved through a 2-Step Photolithography Process and the gate region of the AlGaN/GaN HEMT was defined by using two lithography steps to form gamma-shaped gates. The 4-inch AlGaN/GaN HEMT wafer demonstrated high electrical performance uniformity with respect to the maximum drain-source current density (IDSS), the peak extrinsic output transconductance (Gm), and the threshold voltage (Vth). At
               
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