An increasing demand for surface acoustic wave filters with high performances contributes to the necessity of reducing sizes and costs. The present work proposes a multilayered structure of high-velocity layer/SiO2/interdigital… Click to show full abstract
An increasing demand for surface acoustic wave filters with high performances contributes to the necessity of reducing sizes and costs. The present work proposes a multilayered structure of high-velocity layer/SiO2/interdigital transducers (IDTs)/piezoelectric-single-crystal substrate to further validate the strengths of packageless devices. Resonators based on the SiNx/SiO2/IDTs(Cu)/15°Y-X LiNbO3 structure are simulated and analyzed. One-port resonators are designed, fabricated and tested on the basis of the simulation, and results validates the feasibility of no encapsulation. Finally, by using this multilayered structure, a packageless filter with a center frequency of 2.14 GHz and an ultra-small size of
               
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