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High resolution synchrotron tomography has demonstrated a proportionality between electromigration induced void volume and time-to-failure in hybrid bonding based test structures. A conventional failure by voiding in long feed lines… Click to show full abstract
High resolution synchrotron tomography has demonstrated a proportionality between electromigration induced void volume and time-to-failure in hybrid bonding based test structures. A conventional failure by voiding in long feed lines was observed. Process induced bonding voids do not affect reliability of the analyzed samples.
Keywords:
high resolution;
tomography;
time failure;
failure;
electromigration
Journal Title: IEEE Electron Device Letters
Year Published: 2019
Link to full text (if available)
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Journal Title: IEEE Electron Device Letters
Year Published: 2019
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!