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Ultra-Wideband Vialess Microstrip Line-to-Stripline Transition in Multilayer LCP Substrate for $E$ - and $W$ -Band Applications

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In this letter, we present an ultra-wideband microstrip line (MSL)-to-stripline (SL) transition without using vias or coupled slot in multilayer liquid crystal polymer (LCP) substrate at millimeter-wave frequencies. The proposed… Click to show full abstract

In this letter, we present an ultra-wideband microstrip line (MSL)-to-stripline (SL) transition without using vias or coupled slot in multilayer liquid crystal polymer (LCP) substrate at millimeter-wave frequencies. The proposed transition is achieved by using an asymmetric parallel SL to connect MSL and SLs signal lines in different layers, and its full-wave simulation predicts an insertion loss of less than 1.1 dB at $E$ - and $W$ -bands. To demonstrate this design experimentally, an MSL-to-SL-to-MSL transition was fabricated and characterized. The measured insertion loss of this back-to-back transition is less than 2 dB with a return loss higher than 13 dB from 60 to 110 GHz, showing good agreement with the simulated data.

Keywords: transition; lcp substrate; inline formula; microstrip line; ultra wideband; stripline transition

Journal Title: IEEE Microwave and Wireless Components Letters
Year Published: 2017

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