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This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of… Click to show full abstract
This letter develops a simplified circuit model for the shielded differential through-silicon vias (SD-TSVs). The model is consisted of four frequency-independent elements and can accurately predict the insertion loss of the SD-TSVs up to 20 GHz. Based on the model, a parallel resistor–capacitor equalizer is proposed. The proposed passive equalizer achieves wide-band equalization and perfect compensation for high-speed differential signaling.
Keywords:
silicon vias;
equalizer;
passive equalizer;
differential silicon;
shielded differential
Journal Title: IEEE Microwave and Wireless Components Letters
Year Published: 2018
Link to full text (if available)
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Journal Title: IEEE Microwave and Wireless Components Letters
Year Published: 2018
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!