This letter reports on the $W$ -band power performance of N-polar GaN deep recess MIS–high electron mobility transistors (HEMTs) using a new atomic layer deposition (ALD) ruthenium (Ru) gate metallization… Click to show full abstract
This letter reports on the $W$ -band power performance of N-polar GaN deep recess MIS–high electron mobility transistors (HEMTs) using a new atomic layer deposition (ALD) ruthenium (Ru) gate metallization process. The deep recess structure is utilized to control the DC-RF dispersion and increase the conductivity in the access regions. The ALD Ru effectively fills the narrow T-gate stems aiding realization of shorter gate lengths with lower gate resistance than in prior work. In this work, the gate length was scaled down to 48 nm, resulting in the demonstration of a record high 8.1-dB linear transducer gain measured at 94 GHz by load pull. This increased gain has enabled a record 33.8% power-added efficiency (PAE) with an associated output power density ($P_{\mathrm {O}}$ ) of 6.2 W/mm.
